INTERNATIONAL PATENT: LIGHTMATTER, INC. FILES APPLICATION FOR "PLUGGABLE FIBER-TO-CHIP COUPLING FOR WAFER SCALE CO-PACKAGED OPTICS"

GENEVA, Nov. 11 -- LIGHTMATTER, INC. (100 Summer StreetBoston, MA 02110) filed a patent application (PCT/US2025/027286) for "PLUGGABLE FIBER-TO-CHIP COUPLING FOR WAFER SCALE CO-PACKAGED OPTICS" on May 01, 2025. With publication no. WO/2025/231239, the details related to the patent application was published on Nov 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): GUPTA, Shashank (c/o Lightmatter, Inc.100 Summer StreetBoston, MA 02110), SRINIVASAN, Srinivasan, Ashwyn (30 Wentworth AvenueNorth YorkToronto, ON M2N 1T6), SANE, Sandeep (c/o Lightmatter, Inc.100 Summer StreetBoston, MA 02110), AH...