INTERNATIONAL PATENT: LIGHTMATTER, INC. FILES APPLICATION FOR "CHIP ON WAFER-TO-WAFER-BONDED INTERCONNECT PLATFORM WITH STACKED TSVS"

GENEVA, Aug. 6 -- LIGHTMATTER, INC. (100 Summer StreetBoston, MA 02110) filed a patent application (PCT/US2025/012847) for "CHIP ON WAFER-TO-WAFER-BONDED INTERCONNECT PLATFORM WITH STACKED TSVS" on Jan 24, 2025. With publication no. WO/2025/160325, the details related to the patent application was published on Jul 31, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LIU, Kuang (18524 East Chandler Heights RoadQueen Creek, AZ 85142), BHARATH, Krishna (11161 NW Montreux LanePortland, OR 97229), JAIN, Ritesh (5491 Northwest Primino AvenuePortland, OR 97229)

Abstract: Described herein are elec...