INTERNATIONAL PATENT: LG ELECTRONICS INC., 엘지전자 주식회사 FILES APPLICATION FOR "HEATING COIL ASSEMBLY, HOME APPLIANCE HAVING SAME AND MANUFACTURING METHOD THEREFOR"

GENEVA, April 1 -- LG ELECTRONICS INC. (128, Yeoui-daeroYeongdeungpo-guSeoul 07336), 엘지전자 주식회사 (서울특별시영등포구여의대로 128) filed a patent application (PCT/KR2024/014079) for "HEATING COIL ASSEMBLY, HOME APPLIANCE HAVING SAME, AND MANUFACTURING METHOD THEREFOR" on Sep 13, 2024. With publication no. WO/2025/063678, the details related to the patent application was published on Mar 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): OH, Dooyong (IP Center, L...