INTERNATIONAL PATENT: LEEBIO, INC., 주식회사 리바이오 FILES APPLICATION FOR "MODULAR ASSEMBLY-TYPE DIAGNOSTIC KIT"

GENEVA, July 9 -- LEEBIO, INC. (Room 210, 2nd floor, 188, Chuncheon-roChuncheon-siGangwon-do 24329), 주식회사 리바이오 (강원특별자치도춘천시춘천로 188, 2층 210호) filed a patent application (PCT/KR2024/019628) for "MODULAR ASSEMBLY-TYPE DIAGNOSTIC KIT" on Dec 03, 2024. With publication no. WO/2025/143614, the details related to the patent application was published on Jul 03, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LEE, Joongjin (103dong 905ho, 8, S...