INTERNATIONAL PATENT: LEE, JONG JOO, 이종주 FILES APPLICATION FOR "HIGH-BANDWIDTH MEMORY HAVING BRIDGE-INTEGRATED LOGIC DIE AND PACKAGE APPLYING SAME"

GENEVA, July 9 -- LEE, Jong Joo (1351-803, 15, Dongtansunhwan-daero 21-gilHwaseong-siGyeonggi-do 18482), 이종주 (경기도화성시동탄순환대로21길 15, 1351-803) filed a patent application (PCT/KR2024/096830) for "HIGH-BANDWIDTH MEMORY HAVING BRIDGE-INTEGRATED LOGIC DIE AND PACKAGE APPLYING SAME" on Dec 12, 2024. With publication no. WO/2025/143997, the details related to the patent application was published on Jul 03, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): LEE, Jong Joo (1351-803, 15, Dongtans...