GENEVA, Dec. 10 -- LEE, Dongkwan (404ho, Cheonwoo Myeongdeok Apartment, 126, Gonghang-daero36-gil, Gangseo-gu, Seoul 07633), 이동관 (서울특별시 강서구 공항대로36길 126, 천우명덕아파트 404호) filed a patent application (PCT/KR2024/007309) for "CUP LID AND PAPER CUP USING SAME" on May 29, 2024. With publication no. WO/2025/249602, the details related to the patent application was published on Dec 04, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): LEE,...