GENEVA, April 1 -- LEE, Dong Hoon (Unit 201, 19, Cheongpa-ro 53-gilYongsan-guSeoul 04309), 이동훈 (서울특별시용산구청파로53길 19, 201호), LEE, Dongyun (1st Fl., 19, Cheongpa-ro 53-gilYongsan-guSeoul 04309), 이동연 (서울특별시용산구청파로53길 19, 1층) filed a patent application (PCT/KR2024/014092) for "MANUFACTURING METHOD FOR RELEASE BINDER HAVING MAIN AGENT AND CURING AGENT INTEGRALLY PACKAGED THEREIN, AND MANUFACTURING DEVICE FOR SAME" on Sep 18, 2024. With publication no. WO/2025/063689, the details related to the patent application was published on...
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