INTERNATIONAL PATENT: LCP MEDICAL TECHNOLOGIES, LLC FILES APPLICATION FOR "HIGH-PERFORMANCE, LOW SIGNAL LOSS, HIGH-DENSITY, MULTI-LAYER, DOUBLE-SIDED 3D PRINTED CIRCUIT STRUCTURE DEPOSITION AND FABRICATION PLATFORM"

GENEVA, July 20 -- LCP MEDICAL TECHNOLOGIES, LLC (11795 Tilton Trail N.Rogers, Minnesota 55374) filed a patent application (PCT/IB2025/050329) for "HIGH-PERFORMANCE, LOW SIGNAL LOSS, HIGH-DENSITY, MULTI-LAYER, DOUBLE-SIDED 3D PRINTED CIRCUIT STRUCTURE DEPOSITION AND FABRICATION PLATFORM" on Jan 11, 2025. With publication no. WO/2025/149986, the details related to the patent application was published on Jul 17, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): RATHBURN, James (11795 Tilton Trail N.Rogers, Minnesota 55374)

Abstract: A 3D printer for creating high-performance electrical circui...