INTERNATIONAL PATENT: LASER WIRE SOLUTIONS LIMITED FILES APPLICATION FOR "METHOD OF USING A DEVICE AND CORRESPONDING DEVICE TO ABLATE AND/OR CUT AT LEAST A PORTION OF A REMOVABLE LAYER OF AT LEAST ONE WIRE"

GENEVA, Aug. 25 -- LASER WIRE SOLUTIONS LIMITED (QED Centre Main AvenueTreforest Industrial EstatePontypridd Rhondda Cynon Taff CF37 5YR) filed a patent application (PCT/GB2025/050221) for "METHOD OF USING A DEVICE AND CORRESPONDING DEVICE TO ABLATE AND/OR CUT AT LEAST A PORTION OF A REMOVABLE LAYER OF AT LEAST ONE WIRE" on Feb 05, 2025. With publication no. WO/2025/172687, the details related to the patent application was published on Aug 21, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CABBLE, Paul (C/O Laser Wire Solutions LimitedQED Centre Main AvenueTreforest Industrial EstatePontypr...