GENEVA, Jan. 12 -- LAMBDA RESINS GMBH (HeinkelstraBe 1050169 Kerpen) filed a patent application (PCT/EP2025/068668) for "HEAT-CONDUCTING CASTING RESIN AND METHOD FOR PRODUCING AN ELECTRO-TECHNICAL ASSEMBLY" on Jul 01, 2025. With publication no. WO/2026/008618, the details related to the patent application was published on Jan 08, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): KOHLER, Uwe (Heinkelstrasse 1050169 Kerpen)
Abstract: A heat-conducting casting resin comprises at least one resin and filler particles of different size classes. The filler particles have a trimodal size distribution...