INTERNATIONAL PATENT: LAM RESEARCH CORPORATION FILES APPLICATION FOR "LOW TEMPERATURE DOPED POLYSI BACKSIDE DEPOSITION FILM FOR ENHANCED CHUCKING/DECHUCKING IN SEMICONDUCTOR PROCESSING"

GENEVA, Jan. 6 -- LAM RESEARCH CORPORATION (4650 Cushing Pkwy.Fremont, California 94538) filed a patent application (PCT/US2025/035211) for "LOW TEMPERATURE DOPED POLYSI BACKSIDE DEPOSITION FILM FOR ENHANCED CHUCKING/DECHUCKING IN SEMICONDUCTOR PROCESSING" on Jun 25, 2025. With publication no. WO/2026/006421, the details related to the patent application was published on Jan 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HAMMA, Soumana (4650 Cushing Pkwy.Fremont, California 94538), GRENINGER, Sonia (4650 Cushing Pkwy.Fremont, California 94538), CHAN, Michael Anthony (4650 Cushing Pkwy.F...