INTERNATIONAL PATENT: LAM RESEARCH CORPORATION FILES APPLICATION FOR "IN-SITU HIGH ASPECT RATIO ETCH WITH A RE-DEPOSITED HELMET MASK"

GENEVA, March 18 -- LAM RESEARCH CORPORATION (4650 Cushing ParkwayFremont, California 94538) filed a patent application (PCT/US2024/045103) for "IN-SITU HIGH ASPECT RATIO ETCH WITH A RE-DEPOSITED HELMET MASK" on Sep 04, 2024. With publication no. WO/2025/054152, the details related to the patent application was published on Mar 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): RALSTON, Walter Thomas (c/o Lam Research Corporation4650 Cushing Parkway, M/S CA-1Fremont, California 94538), OZEL, Taner (c/o Lam Research Corporation4650 Cushing Parkway, M/S CA-1Fremont, California 94538), WONG, M...