INTERNATIONAL PATENT: LAM RESEARCH CORPORATION FILES APPLICATION FOR "HIGH ASPECT RATIO PLASMA ETCHING WITH CONTROLLED DECLOGGING"

GENEVA, Jan. 27 -- LAM RESEARCH CORPORATION (4650 Cushing Pkwy.Fremont, California 94538) filed a patent application (PCT/US2025/037656) for "HIGH ASPECT RATIO PLASMA ETCHING WITH CONTROLLED DECLOGGING" on Jul 15, 2025. With publication no. WO/2026/019766, the details related to the patent application was published on Jan 22, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): TAN, Zhongkui (4650 Cushing Pkwy.Fremont, California 94538), SU, Xiaofeng (4650 Cushing Pkwy.Fremont, California 94538), MA, Yilin (4650 Cushing Pkwy.Fremont, California 94538), JIN, Yansha (4650 Cushing Pkwy.Fremont, Cali...