INTERNATIONAL PATENT: LAM RESEARCH CORPORATION FILES APPLICATION FOR "ELECTROSTATIC CHUCK WITH HIGH-DENSITY PLASMA BARRIER COATING"

GENEVA, Feb. 4 -- LAM RESEARCH CORPORATION (4650 Cushing ParkwayFremont, California 94538) filed a patent application (PCT/US2024/038716) for "ELECTROSTATIC CHUCK WITH HIGH-DENSITY PLASMA BARRIER COATING" on Jul 19, 2024. With publication no. WO/2025/024263, the details related to the patent application was published on Jan 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HORNG, Miin Liang (4650 Cushing ParkwayFremont, California 94538), QI, Chengzhu (4650 Cushing ParkwayFremont, California 94538)

Abstract: An electrostatic chuck comprises a substrate-facing surface comprising one or m...