GENEVA, July 2 -- KYOCERA TECHNOLOGIES OY (Tietotie 302150 Espoo) filed a patent application (PCT/FI2024/050634) for "SEALING PROCESS" on Nov 25, 2024. With publication no. WO/2025/133444, the details related to the patent application was published on Jun 26, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): WILJANEN, Heikki (c/o KYOCERA Technologies Oy, Tietotie 3,02150 Espoo)
Abstract:
Herein is provided a method for sealing a chip (100), the method comprising arranging holes (120) to respective gaps (105) in between a cap wafer (104) and a device wafer (101, 102, 103) bonded together for...