INTERNATIONAL PATENT: KYOCERA INTERNATIONAL, INC. FILES APPLICATION FOR "MICROELECTRONIC PACKAGE WITH NON-MAGNETIC PLATING STRUCTURE"

GENEVA, Feb. 18 -- KYOCERA INTERNATIONAL, INC. (8611 Balboa AvenueSan Diego, California 92123) filed a patent application (PCT/US2024/041184) for "MICROELECTRONIC PACKAGE WITH NON-MAGNETIC PLATING STRUCTURE" on Aug 07, 2024. With publication no. WO/2025/034788, the details related to the patent application was published on Feb 13, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): NORDEEN, Maria (c/o Kyocera International, Inc. IP Dept.8611 Balboa AvenueSan Diego, California 92123), GARLAND, Paul (c/o Kyocera International, Inc. IP Dept.8611 Balboa AvenueSan Diego, California 92123), FITCH, Cyr...