GENEVA, Jan. 6 -- KYOCERA CORPORATION (6, Takeda Tobadono-cho, Fushimi-ku, Kyoto-shi, Kyoto6128501), 京セラ株式会社 (京都府京都市伏見区竹田鳥羽殿町6番地) filed a patent application (PCT/JP2025/023340) for "ELECTRONIC ELEMENT HOUSING PACKAGE, ELECTRONIC MODULE, AND ELECTRONIC DEVICE" on Jun 27, 2025. With publication no. WO/2026/005051, the details related to the patent application was published on Jan 02, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inv...