GENEVA, Feb. 3 -- KUREHA CORPORATION (3-3-2, Nihonbashi-Hamacho, Chuo-ku, Tokyo1038552), 株式会社クレハ (東京都中央区日本橋浜町三丁目3番2号) filed a patent application (PCT/JP2025/024821) for "THERMALLY EXPANDABLE MICROCAPSULE, METHOD FOR PRODUCING SAME, RESIN COMPOSITION, AND METHOD FOR PRODUCING FOAM MOLDED BODY" on Jul 10, 2025. With publication no. WO/2026/023435, the details related to the patent application was published on Jan 29, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual ...