GENEVA, Dec. 1 -- KURARAY CO., LTD. (1621, Sakazu, Kurashiki-shi, Okayama7100801), 株式会社クラレ (岡山県倉敷市酒津1621番地) filed a patent application (PCT/JP2025/018582) for "MULTILAYER STRUCTURE AND PACKAGING MATERIAL INCLUDING SAME" on May 22, 2025. With publication no. WO/2025/244100, the details related to the patent application was published on Nov 27, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): ISHIHARA, Hisashi (c/o Kuraray Co., Ltd., 7471, Tamashimao...