INTERNATIONAL PATENT: KULICKE AND SOFFA HI-TECH CO., LTD. FILES APPLICATION FOR "SOLDER JETTING HEAD CAPABLE OF REDUCING SOLDER PASTE ACCUMULATION AND RELATED DISPENSING SYSTEMS AND METHODS"

GENEVA, March 31 -- KULICKE AND SOFFA HI-TECH CO., LTD. (No. 1-2 Zhongshan Road, Tucheng District, New Taipei CityTaiwan) filed a patent application (PCT/CN2024/117679) for "SOLDER JETTING HEAD CAPABLE OF REDUCING SOLDER PASTE ACCUMULATION, AND RELATED DISPENSING SYSTEMS AND METHODS" on Sep 09, 2024. With publication no. WO/2025/060913, the details related to the patent application was published on Mar 27, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): CHEN, Lu-Min (No. 1-2 Zhongshan Road, Tucheng District, New Taipei CityTaiwan 236044)

Abstract: A solder jetting head for depositing a so...