GENEVA, Jan. 13 -- KOKUYO CO., LTD. (6-1-1, Oimazato-minami, Higashinari-ku, Osaka-shi, Osaka5378686), コクヨ株式会社 (大阪府大阪市東成区大今里南６丁目１番１号) filed a patent application (PCT/JP2024/024359) for "BINDING TOOL AND BINDER" on Jul 05, 2024. With publication no. WO/2026/009399, the details related to the patent application was published on Jan 08, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): SANO Chiune (C/O KOKUYO C...