GENEVA, March 31 -- KOKOKU INTECH CO., LTD. (1-13-13 Higashiueno, Taito-ku, Tokyo1100015), 興国インテック株式会社 (東京都台東区東上野１－１３－１３) filed a patent application (PCT/JP2023/033848) for "BONDING METHOD AND BONDED OBJECT" on Sep 19, 2023. With publication no. WO/2025/062475, the details related to the patent application was published on Mar 27, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): MORI Keisuke (c/o KOKOKU INT...