GENEVA, Feb. 17 -- KOKI COMPANY LIMITED (32-1, Senju Asahi-cho, Adachi-ku, Tokyo1200026), 株式会社弘輝 (東京都足立区千住旭町３２番１) filed a patent application (PCT/JP2023/029244) for "FLUX, SOLDER PASTE, AND METHOD FOR PRODUCING BONDED STRUCTURE" on Aug 10, 2023. With publication no. WO/2025/032800, the details related to the patent application was published on Feb 13, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): OOTANI, Satoshi (c/o KOKI Company Limited, 32-1, Senju A...