INTERNATIONAL PATENT: KMW INC., 주식회사 케이엠더블유 FILES APPLICATION FOR "CONDENSING PANEL ASSEMBLY AND HEAT DISSIPATION DEVICE INCLUDING SAME"

GENEVA, March 10 -- KMW INC. (183-19, Yeongcheon-roHwaseong-siGyeonggi-do 18462), 주식회사 케이엠더블유 (경기도화성시영천로 183-19) filed a patent application (PCT/KR2024/012209) for "CONDENSING PANEL ASSEMBLY AND HEAT DISSIPATION DEVICE INCLUDING SAME" on Aug 16, 2024. With publication no. WO/2025/048356, the details related to the patent application was published on Mar 06, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): KIM, Duk Yong (25, Giheungdanji-ro 136beon-gil, Giheung-g...