GENEVA, May 14 -- KLA CORPORATION (One Technology DriveMilpitas, California 95035) filed a patent application (PCT/US2024/053316) for "YIELD IMPROVEMENTS IN STACKED PACKAGING" on Oct 29, 2024. With publication no. WO/2025/096369, the details related to the patent application was published on May 08, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WANG, Xuewen (5th floor, Building NO.88Lane 887 Zu Chongzhi RoadShanghai, Shanghai 201210)

Abstract: Shape-changed induced stress for a target thickness of a bonded wafer can be determined. A bonding strength for the bonded wafer can then be dete...