INTERNATIONAL PATENT: KLA CORPORATION FILES APPLICATION FOR "METHODS AND SYSTEMS FOR CHUCKING HIGHLY BOWED SEMICONDUCTOR WAFERS"

GENEVA, Dec. 10 -- KLA CORPORATION (One Technology DriveMilpitas, California 95035) filed a patent application (PCT/US2025/030925) for "METHODS AND SYSTEMS FOR CHUCKING HIGHLY BOWED SEMICONDUCTOR WAFERS" on May 27, 2025. With publication no. WO/2025/250480, the details related to the patent application was published on Dec 04, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): PHARAND, Michel (14161 Old Japanese RoadLos Gatos, California 95033)

Abstract: Methods and systems for vacuum mounting a highly bowed, thin substrate, such as a semiconductor wafer, onto a flat chuck are presented herein...