INTERNATIONAL PATENT: KLA CORPORATION FILES APPLICATION FOR "FLATNESS PRECISION IMPROVEMENT WITH SYSTEMATIC ERROR REDUCTION VIA INDUCED WAFER TILT VARIATION"

GENEVA, Sept. 10 -- KLA CORPORATION (One Technology DriveMilpitas, California 95035) filed a patent application (PCT/US2025/015449) for "FLATNESS PRECISION IMPROVEMENT WITH SYSTEMATIC ERROR REDUCTION VIA INDUCED WAFER TILT VARIATION" on Feb 12, 2025. With publication no. WO/2025/183890, the details related to the patent application was published on Sep 04, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): ZHANG, Taishi (#13-07, 89 Yishun Avenue 1Singapore 769134), GUO, Wenjiang (Blk 694A Woodlands Drive 62, 09-06Singapore 731694)

Abstract: A workpiece is placed on a stage in an interferomet...