GENEVA, March 25 -- KLA CORPORATION (One Technology DriveMilpitas, California 95035) filed a patent application (PCT/US2024/046052) for "CONCENTRICITY OFFSET MEASUREMENT FOR HYBRID BONDING" on Sep 11, 2024. With publication no. WO/2025/059083, the details related to the patent application was published on Mar 20, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): BHATT, Hemang Ashvinbhai (1250 NE Compton Dr, Unit #303Hillsboro, Oregon 97006), VANGAL, Aravindh (29 Upper Serangoon View05-17 Boathouse ResidenceSingapore 534044)

Abstract: A metrology system is used to measure a bonded wafer with...