GENEVA, Feb. 3 -- KIM, Ji Hwan (17 Seosulla-gil, Jongno-gu, Seoul, 03138), 김지환 (서울특별시 종로구 서순라길 17) filed a patent application (PCT/KR2024/019222) for "ENGRAVING FILLER AND METHOD FOR MANUFACTURING SAME" on Nov 29, 2024. With publication no. WO/2026/023755, the details related to the patent application was published on Jan 29, 2026.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): PARK, Si Eun (46 Yeouidaebang-ro 26-gilDongjak-guSeoul 07055), 박시은 (서울특0...