INTERNATIONAL PATENT: KEPLER COMPUTING INC. FILES APPLICATION FOR "MEMORY DEVICE FABRICATION THROUGH WAFER BONDING"

GENEVA, Oct. 6 -- KEPLER COMPUTING INC. (180 Steuart Street #192524San Francisco, California 94105) filed a patent application (PCT/US2025/018403) for "MEMORY DEVICE FABRICATION THROUGH WAFER BONDING" on Mar 04, 2025. With publication no. WO/2025/207285, the details related to the patent application was published on Oct 02, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): GUHA, Biswajeet (548 NE Amanda PlaceHillsboro, Oregon 97124), MANFRINI, Mauricio (Geldenaaksebaan 1733001 Heverlee), SATO, Noriyuki (845 Altaire WalkPalo Alto, California 94303), CLARKSON, James David (1264 Kilcrease CircleE...