GENEVA, Dec. 30 -- KAO CORPORATION (14-10, Nihonbashi Kayabacho 1-chome, Chuo-ku, Tokyo1038210), 花王株式会社 (東京都中央区日本橋茅場町１丁目１４番１０号) filed a patent application (PCT/JP2025/021674) for "BINDER COMPOSITION FOR MOLDING CASTING MOLD" on Jun 16, 2025. With publication no. WO/2025/263478, the details related to the patent application was published on Dec 26, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): YAMAGUCHI,D...