INTERNATIONAL PATENT: KANADEVIA CORPORATION, カナデビア株式会社 FILES APPLICATION FOR "CONTINUOUS BONDING DEVICE AND CONTINUOUS BONDING METHOD"

GENEVA, Oct. 13 -- KANADEVIA CORPORATION (7-89, Nanko-kita 1-chome, Suminoe-ku, Osaka-shi, Osaka5598559), カナデビア株式会社 (大阪府大阪市住之江区南港北１丁目７番８９号) filed a patent application (PCT/JP2024/041922) for "CONTINUOUS BONDING DEVICE AND CONTINUOUS BONDING METHOD" on Nov 27, 2024. With publication no. WO/2025/210957, the details related to the patent application was published on Oct 09, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property O...