GENEVA, Nov. 10 -- KAJI Yuriko (4-18-61, Azamino-minami, Aoba-ku, Yokohama-shi, Kanagawa2250012), 鍛治由里子 (神奈川県横浜市青葉区あざみ野南４丁目１８番６１号) filed a patent application (PCT/JP2024/041528) for "BUNDLING TOOL" on Nov 22, 2024. With publication no. WO/2025/229772, the details related to the patent application was published on Nov 06, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): KAJI Yuriko (4-18-61, Az...