GENEVA, June 10 -- JSR CORPORATION (9-2, Higashi-Shinbashi 1-chome, Minato-ku, Tokyo1058640), JSR株式会社 (東京都港区東新橋一丁目9番2号) filed a patent application (PCT/JP2024/040247) for "RESIN COMPOSITION, CURED OBJECT, AND ELECTRONIC COMPONENT" on Nov 13, 2024. With publication no. WO/2025/115606, the details related to the patent application was published on Jun 05, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): IIZUKA Shunsuke (c/o JSR CORPORATION, 9-...