GENEVA, June 18 -- JIN, Sung Ho (1602ho, 103dong, 16 Hyowon-ro 308beon-gil, Paldal-guSuwon-siGyeonggi-do 16491), 진성호 (경기도수원시팔달구 효원로308번길 16, 103동 1602호) filed a patent application (PCT/KR2024/018946) for "IMAGE SENSOR PACKAGE INCLUDING PILLAR BUMP" on Nov 27, 2024. With publication no. WO/2025/121767, the details related to the patent application was published on Jun 12, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): JIN, Sung Ho (1602ho, 103dong, 16 Hyowon-ro...