INTERNATIONAL PATENT: JETCOOL TECHNOLOGIES INC. FILES APPLICATION FOR "AREA-ENHANCED COOLING MODULE AND ELECTRONIC ASSEMBLY WITH MICROJET CAPTURE MANIFOLD"

GENEVA, Jan. 6 -- JETCOOL TECHNOLOGIES INC. (305 Foster StreetLittleton, Massachusetts 01460) filed a patent application (PCT/US2025/034806) for "AREA-ENHANCED COOLING MODULE AND ELECTRONIC ASSEMBLY WITH MICROJET CAPTURE MANIFOLD" on Jun 23, 2025. With publication no. WO/2026/006186, the details related to the patent application was published on Jan 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): HABER, Ludwig C. (c/o JetCool Technologies Inc.305 Foster StreetLittleton, Massachusetts 01460), BOGGIO, Cameron (c/o JetCool Technologies Inc.305 Foster StreetLittleton, Massachusetts 01460)

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