GENEVA, July 8 -- JCU CORPORATION (8-1, Higashiueno 4-chome, Taito-ku, Tokyo1100015), 株式会社ＪＣＵ (東京都台東区東上野４丁目８番１号) filed a patent application (PCT/JP2024/037528) for "NICKEL-BASED ALLOY PLATING SOLUTION" on Oct 22, 2024. With publication no. WO/2025/142057, the details related to the patent application was published on Jul 03, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): TSUJINO Shun (c/o JCU CORPORATION, R&D Center, 4-3, Kurigi 2-c...