INTERNATIONAL PATENT: JCU CORPORATION, 株式会社ＪＣＵ FILES APPLICATION FOR "ETCHING SOLUTION FOR TITANIUM AND COPPER AND MANUFACTURING METHOD AND ETCHING METHOD FOR WIRING BOARD USING SAME"

GENEVA, July 8 -- JCU CORPORATION (8-1, Higashiueno 4-chome, Taito-ku, Tokyo1100015), 株式会社ＪＣＵ (東京都台東区東上野４丁目８番１号) filed a patent application (PCT/JP2023/047284) for "ETCHING SOLUTION FOR TITANIUM AND COPPER, AND MANUFACTURING METHOD AND ETCHING METHOD FOR WIRING BOARD USING SAME" on Dec 28, 2023. With publication no. WO/2025/141873, the details related to the patent application was published on Jul 03, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO)...