INTERNATIONAL PATENT: ITT MANUFACTURING ENTERPRISES LLC FILES APPLICATION FOR "SOLDERLESS BUSSING CONTACT FOR MULTI-PIN CONNECTOR SYSTEMS"

GENEVA, Aug. 26 -- ITT MANUFACTURING ENTERPRISES LLC (100 Washington Boulevard, 6th FloorStamford, Connecticut 06902) filed a patent application (PCT/US2024/054619) for "SOLDERLESS BUSSING CONTACT FOR MULTI-PIN CONNECTOR SYSTEMS" on Nov 06, 2024. With publication no. WO/2025/174428, the details related to the patent application was published on Aug 21, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): FINONA, Michael Santos (56 Technology DriveIrvine, California 92618), GRANTCHAROVA, Ilina Dimitrova (56 Technology DriveIrvine, California 92618)

Abstract: Various structures for solderless bu...