GENEVA, April 17 -- ISOLA USA CORP. (6565 W. Frye RoadChandler, AZ 85226) filed a patent application (PCT/US2024/049783) for "THERMOSETTING COMPOSITIONS, CURED COMPOSITIONS, AND PREPREGS AND LAMINATES BASED ON SAME" on Oct 03, 2024. With publication no. WO/2025/076217, the details related to the patent application was published on Apr 10, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): WONG, Teck Kai (c/o Isola Group164 Gul Circle, #01-06Singapore)

Abstract: This disclosure relates to thermosetting compositions suitable for use in making electronic materials such as circuit board substrat...