INTERNATIONAL PATENT: IQM FINLAND OY FILES APPLICATION FOR "DISTRIBUTED GROUNDING FOR CO-PLANAR WAVEGUIDE"

GENEVA, May 5 -- IQM FINLAND OY (Keilaranta 1902150 Espoo) filed a patent application (PCT/FI2024/050562) for "DISTRIBUTED GROUNDING FOR CO-PLANAR WAVEGUIDE" on Oct 21, 2024. With publication no. WO/2025/088247, the details related to the patent application was published on May 01, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): JULIUSSON, Kristinn (c/o IQM Finland OyKeilaranta 1902150 Espoo)

Abstract: There is provided improved grounding for a co-planar waveguide in a superconducting chip An arrangement for a superconducting chip comprises a first substrate (102) that comprises a first c...