INTERNATIONAL PATENT: IOW, LLC FILES APPLICATION FOR "PACKAGING MATERIAL HAVING EXPANDABLE LAYERS"

GENEVA, June 25 -- IOW, LLC (500 NW 4th PlaceRenton, Washington 98057) filed a patent application (PCT/US2024/059547) for "PACKAGING MATERIAL HAVING EXPANDABLE LAYERS" on Dec 11, 2024. With publication no. WO/2025/128690, the details related to the patent application was published on Jun 19, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): TALDA, Timothy Alan (500 NW 4th PlaceRenton, Washington 98057), MORAN, John Michael (1080 Epperly WayWest Linn, Oregon 97068)

Abstract: A packaging material including one or more expandable layers that provide protection to contents of a packaging enclos...