INTERNATIONAL PATENT: INVENSENSE, INC. FILES APPLICATION FOR "ULTRASONIC SENSOR PACKAGE WITH DECOUPLED ACOUSTIC MODES"

GENEVA, April 17 -- INVENSENSE, INC. (1745 Technology Drive, Suite 200,San Jose, California 95110) filed a patent application (PCT/US2024/049693) for "ULTRASONIC SENSOR PACKAGE WITH DECOUPLED ACOUSTIC MODES" on Oct 03, 2024. With publication no. WO/2025/076155, the details related to the patent application was published on Apr 10, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): EOVINO, Benjamin Eric (c/o InvenSense, Inc.1745 Technology Drive, Suite 200San Jose, California 95110), SHELTON, Stefon Eric (c/o InvenSense, Inc.1745 Technology Drive, Suite 200San Jose, California 95110), GOERICKE, ...