INTERNATIONAL PATENT: INTERNATIONAL BUSINESS MACHINES CORPORATION, SAMSUNG ELECTRONICS CO., LTD:, IBM DEUTSCHLAND GMBH FILES APPLICATION FOR "LATTICE-MATCHED OXIDE LAYER AS TUNNEL BARRIER FOR PERPENDICULARLY MAGNETIZED HEUSLER COMPOUNDS"

GENEVA, Nov. 3 -- INTERNATIONAL BUSINESS MACHINES CORPORATION (New Orchard RoadArmonk, New York 10504), SAMSUNG ELECTRONICS CO., LTD: (129, Samsung-ro, Yeongtong-guSuwon-siGyeonggi-do 443-742), IBM DEUTSCHLAND GMBH (Schonaicher Str. 22071032 Boblingen) filed a patent application (PCT/EP2025/059400) for "LATTICE-MATCHED OXIDE LAYER AS TUNNEL BARRIER FOR PERPENDICULARLY MAGNETIZED HEUSLER COMPOUNDS" on Apr 07, 2025. With publication no. WO/2025/223814, the details related to the patent application was published on Oct 30, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): GARG, Chirag (c/o IBM Al...