GENEVA, Aug. 18 -- INTERNATIONAL BUSINESS MACHINES CORPORATION (New Orchard RoadArmonkNew York, 10504), IBM ISRAEL SCIENCE AND TECHNOLOGY LTD. (Haifa University Campus165 Aba Khoushy AveMount Carmel3498825 Haifa), IBM (CHINA) INVESTMENT COMPANY LTD. (25/F, Pangu PlazaNo.27, Central North 4th Ring RoadChaoyang DistrictBeijing 100101), SAMSUNG ELECTRONICS CO., LTD. (129, Samsung-ro, Yeongtong-guSuwon-siGyeonggi-do 443-742) filed a patent application (PCT/IB2025/050108) for "MATERIAL STACK WITH IMPROVED DEVICE PERFORMANCE IN PERPENDICULARLY MAGNETIZED HEUSLER FILMS" on Jan 06, 2025. With publication no. WO/2025/169016, the details related to the patent application was published on Aug 14, 2025.
Notably, the patent application was submitted un...