INTERNATIONAL PATENT: INTERNATIONAL BUSINESS MACHINES CORPORATION, IBM DEUTSCHLAND GMBH FILES APPLICATION FOR "MODULAR PACKAGE STRUCTURES WITH INTERPOSERS HAVING ALIGNMENT FEATURES"

GENEVA, June 23 -- INTERNATIONAL BUSINESS MACHINES CORPORATION (New Orchard RoadArmonk, New York 10504), IBM DEUTSCHLAND GMBH (Schonaicher Str. 22071032 Boblingen) filed a patent application (PCT/EP2024/085208) for "MODULAR PACKAGE STRUCTURES WITH INTERPOSERS HAVING ALIGNMENT FEATURES" on Dec 09, 2024. With publication no. WO/2025/125129, the details related to the patent application was published on Jun 19, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): NAH, Jae-Woong (c/o IBM Thomas J Watson Research1101 Kitchawan RoadP.O. Box 218Yorktown Heights, New York 10598), ABRAHAM, David (c/o IBM ...