INTERNATIONAL PATENT: INTERNATIONAL BUSINESS MACHINES CORPORATION, IBM DEUTSCHLAND GMBH FILES APPLICATION FOR "INTEGRATED CIRCUIT INCLUDING MULTIPLE DEVICE LAYERS"

GENEVA, Dec. 29 -- INTERNATIONAL BUSINESS MACHINES CORPORATION (New Orchard RoadArmonk, New York 10504), IBM DEUTSCHLAND GMBH (Schonaicher Str. 22071032 Boblingen) filed a patent application (PCT/EP2025/064064) for "INTEGRATED CIRCUIT INCLUDING MULTIPLE DEVICE LAYERS" on May 22, 2025. With publication no. WO/2025/261704, the details related to the patent application was published on Dec 26, 2025.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): REBOH, Shay (c/o IBM Research257 Fuller RoadAlbany, New York 12203), YAMASHITA, Tenko (c/o IBM Research257 Fuller RoadAlbany, New York 12203), BU, Huiming (...