INTERNATIONAL PATENT: INTERNATIONAL BUSINESS MACHINES CORPORATION, IBM DEUTSCHLAND GMBH FILES APPLICATION FOR "INDUCTOR STRUCTURES IN HYBRID BONDED DEVICES"

GENEVA, Jan. 12 -- INTERNATIONAL BUSINESS MACHINES CORPORATION (New Orchard RoadArmonk, New York 10504), IBM DEUTSCHLAND GMBH (Schonaicher Str. 22071032 Boblingen) filed a patent application (PCT/EP2025/064066) for "INDUCTOR STRUCTURES IN HYBRID BONDED DEVICES" on May 22, 2025. With publication no. WO/2026/008207, the details related to the patent application was published on Jan 08, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inventor(s): JAYANAND, Kishan (c/o IBM Research257 Fuller RoadAlbany, New York 12203), POLOMOFF, Nicholas (c/o IBM Research257 Fuller RoadAlbany, New York 12203), PUROHIT, Visw...