INTERNATIONAL PATENT: INTERNATIONAL BUSINESS MACHINES CORPORATION, IBM (CHINA) COMPANY LIMITED, IBM ISRAEL - SCIENCE & TECHNOLOGY LTD. FILES APPLICATION FOR "HEAT SPREADING AND THERMAL HEAT REMOVAL STRUCTURES"

GENEVA, Jan. 5 -- INTERNATIONAL BUSINESS MACHINES CORPORATION (New Orchard Road,ArmonkNew York, 10504), IBM (CHINA) COMPANY LIMITED (1F, Building A1,No.55 Lane,Chuan He Road,Pudong New District,Shanghai, Shanghai 201203), IBM ISRAEL - SCIENCE & TECHNOLOGY LTD. (Haifa University Campus165 Aba Khoushy AveMount Carmel3498825 Haifa) filed a patent application (PCT/IB2025/055972) for "HEAT SPREADING AND THERMAL HEAT REMOVAL STRUCTURES" on Jun 11, 2025. With publication no. WO/2026/003642, the details related to the patent application was published on Jan 02, 2026.

Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).

Inv...