GENEVA, Dec. 22 -- INTERNATIONAL BUSINESS MACHINES CORPORATION (New Orchard RoadArmonk, New York 10504), IBM (CHINA) COMPANY LIMITED (1F, Building A1, No. 55 Lane, Chuan He RoadPudong New DistrictShanghai, Shanghai 201203), IBM ISRAEL - SCIENCE & TECHNOLOGY LTD (Haifa University Campus165 Aba Khoushy AveMount Carmel31905 Haifa) filed a patent application (PCT/IB2025/055254) for "SELF-ALIGNED BACKSIDE CUT" on May 21, 2025. With publication no. WO/2025/257640, the details related to the patent application was published on Dec 18, 2025.
Notably, the patent application was submitted under the International Patent Classification (IPC) system, which is managed by the World Intellectual Property Organization (WIPO).
Inventor(s): VEGA, Reinaldo (...